| Dimension . | Target . | Achievement or not . | Source . |
|---|---|---|---|
| By 2015 | |||
| Sales revenue | Exceeded 350 billion | Achieved | PWC Report: China’s Impact on the Semiconductor Industry: 2016 Update, p. 13. Retrieved from PWC Report |
| Design | Approaching global leading level | Not achieved | Liu (2023) |
| Manufacturing | 32 nm/28 nm scale production | Delayed achieved | Semiconductor Manufacturing International Corporation Annual Report (2015–2021) |
| Packaging and testing | High-end packaging and testing account for over 30% | Delayed achieved | JCET Group Co., Ltd Annual Report (2015–21) |
| Key Equipment and Materials | 65–45 nm equipment and 12-inch silicon wafers put into use | Delayed achieved | Shenzhen China Micro Semicon Co., Ltd Annual Report (2015–21); NAURA Technology Group Co., Ltd Annual Report (2015–21) |
| By 2020 | |||
| Sales Revenue | Average annual growth rate exceeds 20% | Achieved | Semiconductor Industry Association: China’s Share of Global Chip Sales Now Surpasses Taiwan’s, Closing in on Europe’s and Japan’s Retrieved from Semiconductor Industry Association Release |
| Design | Achieve global leading level | Not achieved | Liu (2023) |
| Manufacturing | 16 nm/14 nm scale production | Delayed achieved | Semiconductor Manufacturing International Corporation Annual Report (2015–21) |
| Packaging and Testing | Achieve global leading level | Not achieved | JCET Group Co., Ltd Annual Report (2015–21) |
| Key Equipment and Materials | Enter global supply chain | Not achieved | Shenzhen China Micro Semicon Co., Ltd Annual Report (2015–21); NAURA Technology Group Co., Ltd Annual Report (2015–21) |
| Dimension . | Target . | Achievement or not . | Source . |
|---|---|---|---|
| By 2015 | |||
| Sales revenue | Exceeded 350 billion | Achieved | PWC Report: China’s Impact on the Semiconductor Industry: 2016 Update, p. 13. Retrieved from PWC Report |
| Design | Approaching global leading level | Not achieved | Liu (2023) |
| Manufacturing | 32 nm/28 nm scale production | Delayed achieved | Semiconductor Manufacturing International Corporation Annual Report (2015–2021) |
| Packaging and testing | High-end packaging and testing account for over 30% | Delayed achieved | JCET Group Co., Ltd Annual Report (2015–21) |
| Key Equipment and Materials | 65–45 nm equipment and 12-inch silicon wafers put into use | Delayed achieved | Shenzhen China Micro Semicon Co., Ltd Annual Report (2015–21); NAURA Technology Group Co., Ltd Annual Report (2015–21) |
| By 2020 | |||
| Sales Revenue | Average annual growth rate exceeds 20% | Achieved | Semiconductor Industry Association: China’s Share of Global Chip Sales Now Surpasses Taiwan’s, Closing in on Europe’s and Japan’s Retrieved from Semiconductor Industry Association Release |
| Design | Achieve global leading level | Not achieved | Liu (2023) |
| Manufacturing | 16 nm/14 nm scale production | Delayed achieved | Semiconductor Manufacturing International Corporation Annual Report (2015–21) |
| Packaging and Testing | Achieve global leading level | Not achieved | JCET Group Co., Ltd Annual Report (2015–21) |
| Key Equipment and Materials | Enter global supply chain | Not achieved | Shenzhen China Micro Semicon Co., Ltd Annual Report (2015–21); NAURA Technology Group Co., Ltd Annual Report (2015–21) |
| Dimension . | Target . | Achievement or not . | Source . |
|---|---|---|---|
| By 2015 | |||
| Sales revenue | Exceeded 350 billion | Achieved | PWC Report: China’s Impact on the Semiconductor Industry: 2016 Update, p. 13. Retrieved from PWC Report |
| Design | Approaching global leading level | Not achieved | Liu (2023) |
| Manufacturing | 32 nm/28 nm scale production | Delayed achieved | Semiconductor Manufacturing International Corporation Annual Report (2015–2021) |
| Packaging and testing | High-end packaging and testing account for over 30% | Delayed achieved | JCET Group Co., Ltd Annual Report (2015–21) |
| Key Equipment and Materials | 65–45 nm equipment and 12-inch silicon wafers put into use | Delayed achieved | Shenzhen China Micro Semicon Co., Ltd Annual Report (2015–21); NAURA Technology Group Co., Ltd Annual Report (2015–21) |
| By 2020 | |||
| Sales Revenue | Average annual growth rate exceeds 20% | Achieved | Semiconductor Industry Association: China’s Share of Global Chip Sales Now Surpasses Taiwan’s, Closing in on Europe’s and Japan’s Retrieved from Semiconductor Industry Association Release |
| Design | Achieve global leading level | Not achieved | Liu (2023) |
| Manufacturing | 16 nm/14 nm scale production | Delayed achieved | Semiconductor Manufacturing International Corporation Annual Report (2015–21) |
| Packaging and Testing | Achieve global leading level | Not achieved | JCET Group Co., Ltd Annual Report (2015–21) |
| Key Equipment and Materials | Enter global supply chain | Not achieved | Shenzhen China Micro Semicon Co., Ltd Annual Report (2015–21); NAURA Technology Group Co., Ltd Annual Report (2015–21) |
| Dimension . | Target . | Achievement or not . | Source . |
|---|---|---|---|
| By 2015 | |||
| Sales revenue | Exceeded 350 billion | Achieved | PWC Report: China’s Impact on the Semiconductor Industry: 2016 Update, p. 13. Retrieved from PWC Report |
| Design | Approaching global leading level | Not achieved | Liu (2023) |
| Manufacturing | 32 nm/28 nm scale production | Delayed achieved | Semiconductor Manufacturing International Corporation Annual Report (2015–2021) |
| Packaging and testing | High-end packaging and testing account for over 30% | Delayed achieved | JCET Group Co., Ltd Annual Report (2015–21) |
| Key Equipment and Materials | 65–45 nm equipment and 12-inch silicon wafers put into use | Delayed achieved | Shenzhen China Micro Semicon Co., Ltd Annual Report (2015–21); NAURA Technology Group Co., Ltd Annual Report (2015–21) |
| By 2020 | |||
| Sales Revenue | Average annual growth rate exceeds 20% | Achieved | Semiconductor Industry Association: China’s Share of Global Chip Sales Now Surpasses Taiwan’s, Closing in on Europe’s and Japan’s Retrieved from Semiconductor Industry Association Release |
| Design | Achieve global leading level | Not achieved | Liu (2023) |
| Manufacturing | 16 nm/14 nm scale production | Delayed achieved | Semiconductor Manufacturing International Corporation Annual Report (2015–21) |
| Packaging and Testing | Achieve global leading level | Not achieved | JCET Group Co., Ltd Annual Report (2015–21) |
| Key Equipment and Materials | Enter global supply chain | Not achieved | Shenzhen China Micro Semicon Co., Ltd Annual Report (2015–21); NAURA Technology Group Co., Ltd Annual Report (2015–21) |
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